TSMC Launched Production Of 3nm Intel Core Ultra 200V Processors
TSMC factories have started mass production of chips for Intel Lunar Lake mobile processors. This was reported by the Taiwanese publication DigiTimes, citing industry sources. Let us remind you that the official presentation of the Lunar Lake family took place earlier this month.
Lunar Lake is the first Intel processor where all three chiplets (CPU, iGPU and SoC) will be manufactured using TSMC process technology. In particular, we are talking about 3nm N3B technology, as well as 6nm N6 technology.
Intel Lunar Lake processors will be offered in the Core Ultra 200V series. These Intel chips will debut the new Lion Cove P-cores and Skymont E-cores. The same core combination will be used in the Core Ultra 200 (Arrow Lake-S) desktop processors, which are expected to be released in the fourth quarter of this year.
Both chips are manufactured at TSMC facilities: the computing chip is manufactured using N3B technology, and the chip with system logic is manufactured using N6 technology. Intel itself packages the processors using its proprietary Foveros technology.
