Samsung Will Introduce HBM4 Memory In 2025
An important player in the memory chip market, Samsung Electronics Co., has unveiled its plans for the future. According to Sang Joon Hwang, executive vice president of DRAM products and technology at Samsung, the company plans to introduce sixth-generation HBM4 DRAM chips in 2025.
When releasing HBM4 type chips, innovations will be used aimed at improving the thermodynamic properties of this type of product – in other words, solutions will be used for better heat dissipation. When assembling memory stacks, a non-conducting polymer film will be used, which additionally mechanically protects the chips mounted on top of each other. The hybrid copper joining method will combine copper conductors with a film oxide insulator instead of traditional solder.
In addition, as Samsung Electronics representatives admit, at the beginning of 2023 the company created a division that oversees advanced chip packaging methods. The South Korean giant will be ready to offer its customers services for testing and packaging chips using 2.5D and 3D methods, which may be in demand by developers of components for high-performance computing and artificial intelligence systems.
