Intel Figured Out How to Effectively Cool 1000-Watt Chips

Intel engineers have created cooling systems capable of supporting chips with a power of up to 1000 W. Prototypes of the cooling systems were shown at the Foundry Direct Connect conference.

The company has already created working prototypes of the solution for LGA (Land Grid Array) and BGA (Ball Grid Array) processors, and also demonstrated its use on Intel Core Ultra chips and Xeon server processors. The new development ensures that the coolant is supplied not directly to the silicon crystal, but to a special compact cooling unit located on top of the case and equipped with copper microchannels that precisely direct the flow of coolant. These channels can be oriented to specific areas of the crystal with increased heat generation, improving heat dissipation where it is most important. The new system can dissipate heat from a chip with a power consumption of up to 1000 watts using a standard liquid coolant. This may be especially relevant for high-performance AI workloads.

Intel representatives did not say when such liquid cooling systems might be put into mass production.